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The Production Process and Application Advantages of Multilayer PCB Boards

Ⅰ. The production process of multilayer PCB board


  • Materials

  • Inner graphics

  • Inner layer etching

  • Laminate an outer layer drilling

  • The outer layer of copper immersion-full board electroplating

  • Pattern-pattern plating

  • Outer layer etching-screen printing solder mask

  • Silkscreen characters

  • Spraying tin

  • forming

  • Electrical test

  • FQC

  • FQA

  • Packaging

  • Finished products leave factory


Ⅱ. Application advantages of multilayer PCB board

With the continuous development of electronic technology and the increasing requirements of computers for electronic equipment, multilayer PCB boards are currently used in many types of circuit boards in daily life. So what are the advantages of multilayer PCB board applications:


Application advantages of multilayer PCB board:


1. With high assembly density, small size and light weight, it meets the needs of light and miniaturization of electronic equipment;


2. Due to the high assembly density, the wiring between various components (including components) is reduced, the installation is simple, and the reliability is high;


3. Due to the repeatability and consistency of the graphics, the errors in wiring and assembly are reduced, and the maintenance, debugging and inspection time of the equipment is saved;


4. The number of wiring layers can be increased, thereby increasing design flexibility;


5. It can form a circuit with a certain impedance, and can form a high-speed transmission circuit;


6. Circuit, magnetic circuit shielding layer can be set, and metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation.

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