Copper foil is suitable for use in flexible circuit board materials. It can be electrodeposited or plated. The surface of copper foil by electrodeposition is glossy on one side and dull on the other side. It is a flexible material and can be made into many thicknesses and widths. The dull side of ED copper foil is often improved by special treatment. In addition to its flexibility, forged copper foil has the features of hard and smooth. It is suitable for applications where dynamic bending is required.
In addition to bonding insulating film to conductive materials, it can also be used as covering layer, protective coating and covering coating. The main difference between the two lies in the application mode used. The bonding of the covering layer and the insulating film is to form a circuit with laminated structure. The roll-to-roll printing technology is used for the coating of adhesive. Not all laminated construction contains adhesives, and the laminates without adhesives form thinner circuits and greater flexibility. Compared with the laminated structure based on adhesive, it has better thermal conductivity. Because of the thin structure of the adhesive free flexible circuit and the elimination of the thermal resistance of the adhesive, the thermal conductivity of the flexible circuit board can be improved. It can be used in the working environment where the flexible circuit based on the adhesive laminated structure cannot be used.
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