In recent years, under the influence of four major factors: continuous improvement in consumer income, consumer demand upgrade, the rapid development of electronic information technology, active participation of large enterprises, and policy push, China's IoT construction process has accelerated.
The characteristics of the IoT PCB are:
Possibility of denser circuits
Suitable for harsh environments
High tensile strength
Light weight-in fact they can reduce weight by up to 95%.
Increase speed and reliability
Clean circuit paths-HDI boards provide multiple routing options. In addition, designers can replace vias with micro vias, which can greatly improve signal integrity.
Cost Efficiency-Reduced need for layering leads to products and smaller sizes that also bring significant cost advantages.
With the development and complexity of PCBs, challenges are slowly being erased. The future is certainly a driving force for technology and innovation part of where smart PCB manufacturing can play a role.