The immersion silver process of immersion silver pcb manufacturing is between OSP and immersion nickel / gold, and the process is relatively simple and fast. Immersion silver is not a thick armor for PCB. Even if exposed to heat, humidity, and pollution, it can still provide good electrical properties and maintain good solderability, but it will lose its luster. Because there is no nickel under the silver layer, immersion silver does not have all the good physical strength of immersion nickel / gold.
If the PCB has connection functional requirements and needs to reduce costs, immersion silver is a good choice; coupled with the good flatness and contact of immersion silver, then the silver immersion process should be selected.
There are many applications for immersion silver in communication products, automobiles, and computer peripherals, as well as in high-speed signal design. Because immersion silver has good electrical properties unmatched by other surface treatments, it can also be used in high-frequency signals. The immersion silver process is recommended by EMS because it is easy to assemble and has good checkability. Currently about 10% -15% of PCBs use the immersion silver process.