In order to facilitate customers to achieve efficient and high-quality electronic assembly services, Speeda provides customized services for printed circuit boards, including rapid proofing of circuit boards, copying of circuit boards, and mass production of circuit boards. As long as you provide circuit board design documents with relevant requirements, we will promptly produce high-quality PCB boards that meet the design requirements.
The quality level meets the standard IPC2 requirements, ensuring the high quality of the circuit board and making the circuit board more suitable for SMT assembly requirements. The circuit board customization process capabilities are summarized in the following table:
Process Capability | ||
Project | Standard | Sample |
Quality Level | IPC2 | IPC1 |
Number of Layers | 1-32layer | 1-8layer |
Order Quantity | MOQ: 1 | 5-100 (Multiples of 5) |
Delivery Time | 2 Days-5 Weeks | 2-7 Days |
Material | FR4 High Tg Halogen-free Aluminum Substrate Rogers | FR4 |
PCB Size | 6×6mm-600×700mm | 6×6mm-500×500mm |
PCB Size Tolerance | ±0.1mm-±0.3mm | |
PCB Thickness | 0.4mm-3.2mm | 0.4mm-2mm |
Thickness Tolerance | 0.1mm-±10% | |
Copper Thickness | 0.5oz-6oz | 1oz-2oz |
Inner Copper Thickness | 0.5oz-2oz | 0.5oz-1oz |
Copper Thickness Tolerance | ±0.1um-±20um | 0-±20um |
Minimum Wire Width/Distance | 3mil/3mil | 5mil/6mil(Copper Thickness:1oz)3mil/3mil(Copper Thickness:2oz) |
Solder Resist Color | Green, White, Blue, Black, Red, Yellow | |
Character Color | White, Blue, Black, Red, Yellow | White, Black |
Surface Treatment | Leaded/Lead-free HASL | Leaded/Lead-free HASL |
Leaded/Lead-free Chemical Immersion Au/Ag/Sn Organic Solderability Preservatives (OSP) | Leaded/Lead-free Chemical Immersion Au | |
Welding Ring Width | 3mil | 5mil |
Minimum Via Diameter | 6mil(Non-laser) 4mil(Laser) | 8mil |
Minimum Width of Non-electroplated Groove | 0.8mm | |
Non-electroplated Via Diameter Tolerance | ±0.02”(±0.05mm) | |
Minimum Width of Electroplated Groove | 0.6mm | |
Electroplated Via Diameter Tolerance | ±0.03”(±0.08mm) - ±4mil | ±003”(±0.08mm) - ±0.06” |
Copper Thickness within Via | 20um-30um | |
Solder Resist Widowing Tolerance | ±0.03” | |
Ratio of Thickness and Via Diameter | 10:01 | |
Testing | 10V-250V, Flying Probe or Fixture | |
Impedance Tolerance | ±5%-±10% | —— |
Chamfering of G/F | 20, 30, 45, 60 | |
Other Processes | Buried & Blind Via, Peelable Solder Resist, Carbon Oil, High-Temperature Tape, Counter-bored Via, Half Via, Plug Oil in Via/Insert Resin, Via on Pad |
If you need customized circuit board production and assembly services, please select "Contact us" at the bottom of the online, then upload the PCB design file and submit the inquiry request. We will provide you with a quotation for the shortest time. Click the button below to enter the assembly inquiry page!